For download and check: schedule as microsoft project file and compressed versions as pdf
expanded are: DEPFET and ASICs
Module/Ladder assembly
System Components
Please check and give feedback (updates, actual status).
Especially 'System Components' misses a lot of details.
General idea: the DEPFET production is split in two batches. One 'pilot' with a small number of wafers, but fast, so that detectors to start and exercise module assembly will be available as early as possible. A second, larger batch follows with a delay and naturally takes longer. However, it will be ready when module assembly can be done routinely and speedy.
