6–9 Apr 2008
<a HREF="http://www.schloss-ringberg.de/english" target="_blank">Ringberg Castle, Lake Tegernsee</a>
Europe/Berlin timezone

Scope of the Workshop

There is considerable interest of the detector community in the opportunities offered by the new developments in the field of vertical integration of electronic components. This became evident in the very successful first 3DIT Workshop at Palaiseau end of November 2007. The semiconductor industry and the major process equipment manufacturer are very active in this field and the main objective of this workshop will be to investigate how the detector community can contribute and take advantage of these developments.

The interconnection of different technologies like for the sensors, analogue, and digital ASICs offers obviously a lot of advantages but R&D and prototyping in this field can be very cost intensive.  One of the goals of this workshop is the formation of a common platform for the R&D on vertically integrated pixel detector systems which then would give the opportunity to share the experience and open new possibilities for the organization of common projects for LHC and ILC detector development.