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Vertical Integration Technologies for HEP and Imaging Sensors

6–9 Apr 2008
<a HREF="http://www.schloss-ringberg.de/english" target="_blank">Ringberg Castle, Lake Tegernsee</a>
Europe/Berlin timezone

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Session

3D Activities in Industry/Equipment Supplier I

Mo1
7 Apr 2008, 09:00
Lecture Room (<a HREF="http://www.schloss-ringberg.de/english" target="_blank">Ringberg Castle, Lake Tegernsee</a>)

Lecture Room

<a HREF="http://www.schloss-ringberg.de/english" target="_blank">Ringberg Castle, Lake Tegernsee</a>

Presentation materials

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  1. 0. Vertical Integration Technologies: An Overview
    Armin Klumpp (IZM Munich)
    07/04/2008, 09:05
  2. 2. Equipment Development within the EMC3D Consortium
    Markus Wimplinger (EVgroup)
    07/04/2008, 10:00
Building timetable...