Vertical Integration Technologies for HEP and Imaging Sensors

Equipment Development within the EMC3D Consortium

7 Apr 2008, 10:00

25m

Lecture Room (<a HREF="http://www.schloss-ringberg.de/english" target="_blank">Ringberg Castle, Lake Tegernsee</a>)

3D Activities in Industry/Equipment Supplier I

Speaker

Markus Wimplinger (EVgroup)

Presentation materials

Slides

evg.ppt